wbulte
Active Member
Well, wafers are indeed circular in shape. I do not know what diameter wafers the waferfab uses that produces the MF sensors. Typically the more modern the fab the bigger the wafer. This is because the processing (etching, metalising steps, cleaning steps etc etc) cost is more or less the same per wafer, regardless of size. This round wafer is cut into the individual chips aka sensors after the last processing step. I think these days wafers are in the range of 30cm aka 12" for those who still have to make the change to the metric system
How efficient it is to 'floorplan' rectangular versus square sensors? I'm not too sure rectangular is more efficient than square. Any maths freaks around here?
Keep in mind that regardless of shape the yield of a chip process (yield = % of working versus % of defective chips/sensors) is influenced a great deal by the surface area of a single chip/sensor. This makes bigger sensors more than a bit more expensive, specifically because the nature of a photographic sensor dictates it better be faultfree. Compare this to complex RAM chips where sometimes redundant logic is builtin to ensure the end-result / chip is "OK" to the end-user even when there are flaws detected during testing. The redundant logic 'masks' the problem.
Difficult to do with sensors. I am not even sure if it can be done at all. Of course the holy grail of wafer fabs is a very constant processing of all manufacturing steps, resulting in a high yield.
Hope this gives some background why these flimsy APS-C sensors are so popular...
Wilko
How efficient it is to 'floorplan' rectangular versus square sensors? I'm not too sure rectangular is more efficient than square. Any maths freaks around here?
Keep in mind that regardless of shape the yield of a chip process (yield = % of working versus % of defective chips/sensors) is influenced a great deal by the surface area of a single chip/sensor. This makes bigger sensors more than a bit more expensive, specifically because the nature of a photographic sensor dictates it better be faultfree. Compare this to complex RAM chips where sometimes redundant logic is builtin to ensure the end-result / chip is "OK" to the end-user even when there are flaws detected during testing. The redundant logic 'masks' the problem.
Difficult to do with sensors. I am not even sure if it can be done at all. Of course the holy grail of wafer fabs is a very constant processing of all manufacturing steps, resulting in a high yield.
Hope this gives some background why these flimsy APS-C sensors are so popular...
Wilko